Epoxy resin composition and light emitting apparatus

ABSTRACT

Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and an alicyclic epoxy resin.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit under 35 U.S.C. §119 of KoreanPatent Application No. 10-2012-0058859, filed May 31, 2012, which ishereby incorporated by reference in its entirety.

TECHNICAL FIELD

The disclosure relates to an epoxy resin composition and light and lightemitting apparatus.

BACKGROUND

The embodiment relates to an epoxy resin composition and a lightemitting apparatus.

Recently, GaN white light emitting diodes (LED) have been extensivelymanufactured over the whole world. Methods for manufacturing the GaNwhite LED are mainly classified into two methods, one is a method usinga single chip, in which a white LED is obtained by forming a phosphorlayer on a blue LED or a UV LED, and the other is a method using amulti-chip, in which two or more LEDs are combined to obtain a whiteLED.

A representative method for manufacturing the white LED in the form ofthe multi-chip is to combine three R, G and B chips with each other.However, since operating voltage of each chip is not uniform, the outputof each chip may vary depending on the surrounding temperature so thatthe color coordinate may be changed.

Due to the above problem, the multi-chip scheme is not suitable forimplementing the white LED, but suitable for a special-purpose lightingthat reproduces various colors by controlling the brightness of each LEDusing the circuit configuration.

For this reason, the binary system, which can be easily manufactured andobtained by combining a blue LED with a phosphor that is excited by theblue LED to generate yellow color, is representatively used to implementthe white LED.

The binary system mainly employs a white LED, which uses the blue LED asan excitation light source and excites YAG (Yttrium Aluminum Garnet)phosphor using rare-earth 3-valent ion of Ce3+ as an activator, i.e.,YAG:Ce phosphor using an excitation light emitted from the blue LED.

In addition, the white LED employs various packages according toapplications, and representatively includes a surface mounting device(SMD) type ultra-miniaturized LED used in a backlight of a handheldterminal, and a vertical lamp type LED used for an electronic board, asolid display device or an image display.

Meanwhile, an index for analyzing the characteristics of white lightincludes a correlated color temperature (CCT) and a color renderingindex (CRI).

The CCT indicates a temperature of an article when the article shineswith emitting visible rays, it seems that a color of the article isidentical to a color that a black body radiates at a temperature and itis assumed that the temperature of the black body is equal to that ofthe article. As the CCT becomes high, the light dazzles a human andbecomes a bluish white.

Therefore, in spite of identical white lights, when the CCT is low,people feel warm, whereas when the CCT is high, people feel cold.Accordingly, it is possible to meet even the specification of aparticular lighting requiring various color feelings by adjusting theCCT.

In a conventional white LED using the YAG:Ce phosphor, the CCT is fixedonly to 6000 K-8000 K.

The CRI indicates a degree that the color of an article is changed whensun light or artificial light is irradiated onto the article. When thecolor of the article is identical to that under sun light, the CRI isdefined as 100. In other words, the CRI is an index to show how thecolor of the article under the artificial lighting is close to thatunder sun light, and has a value of 0 to 100.

Accordingly, as the CRI approaches 100, i.e., white light, people canfeel that the color of the article under the artificial lighting has nodifference than that under sun light.

At present, an incandescent lamp has a CRI of 80 or more and afluorescent lamp has a CRI of 75 or more, while a white LED using YAG:Cephosphor has a CRI of approximately 70-75.

Accordingly, it is problematic that the white LED using the conventionalYAG:Ce phosphor has the low CCT and low CRI.

In addition, since only the YAG:Ce phosphor is used, it is difficult tocontrol the CCT, CRI and color temperature.

The LED using such a phosphor is disclosed in Korean Unexamined PatentPublication No. 10-2005-0098462.

BRIEF SUMMARY

The embodiment provides an epoxy resin composition and a light emittingapparatus having improved reliability, optical properties andheat-resistant property.

The epoxy resin composition according to the embodiment includes atriazine derivative epoxy resin and an alicyclic epoxy resin.

The light emitting apparatus according to the embodiment includes alight emitting chip, a body part to receive the light emitting chip anda filling part to cover the light emitting chip, wherein the body partor the filling part is formed by an epoxy resin composition comprising atriazine derivative epoxy resin and an alicyclic epoxy resin.

According to one embodiment, the alicyclic epoxy resin may be expressedas a following chemical formula 1:

(wherein, n is 1 to 1000, R1 is selected from hydrogen, a halogen group,an amino group, a C₁-C₃₀ alkyl group, an alkoxy group, a carboxyl groupand a C₅-C₃₀ aryl group, R2 is selected from hydrogen, a halogen group,an amino group, a C₁-C₃₀ alkyl group, an alkoxy group, a carboxyl groupand a C₅-C₃₀ aryl group, and R3 is expressed as a following chemicalformula 2:)

(wherein, m is 0 to 3).

According to one embodiment, the triazine derivative epoxy resin mayinclude an isocyanurate epoxy resin.

According to one embodiment, the isocyanurate epoxy resin may beexpressed as a following chemical formula 4:

(wherein, at least one of R4, R5 and R6 is expressed as the chemicalformula 2 (m is 1 to 3) and a remaining of the R4, R5 and R6 is selectedfrom hydrogen, a halogen group, an amino group, a C₁-C₃₀ alkyl group, analkoxy group, a carboxyl group and a C₅-C₃₀ aryl group).

According to one embodiment, the isocyanurate epoxy resin may includetriglycidylisocyanurate.

According to one embodiment, the alicyclic epoxy resin may be containedat a ratio of about 10 wt % to about 50 wt %.

According to one embodiment, the epoxy resin composition may furtherinclude a hardener, a catalyst and an additive.

The epoxy resin composition according to the embodiment includes thetriazine derivative epoxy resin and the alicyclic epoxy resin. Thus, theepoxy resin composition according to the embodiment may have theimproved moisture-resistant property, heat-resistant property andtransmittance.

The epoxy resin composition according to the embodiment may have theimproved reliability and optical properties by appropriately combiningthe triazine derivative epoxy resin, such as the isocyanurate epoxyresin, with the alicyclic epoxy resin.

The epoxy resin composition according to the embodiment can be used forthe body part or the filling part of the light emitting apparatus, suchas a light emitting diode package. Therefore, the light emittingapparatus according to the embodiment may have the improved reliabilityand optical properties.

BRIEF DESCRIPTION OF THE DRAWING

FIG. 1 is a sectional view showing a light emitting diode packageaccording to the embodiment.

DETAILED DESCRIPTION

Hereinafter, an epoxy resin composition according to the embodiment willbe described in detail.

The epoxy resin composition according to one embodiment includes anepoxy resin, a hardener, a catalyst and an additive.

The epoxy resin may comprise the whole content of the epoxy resincomposition according to the embodiment. The epoxy resin may becontained at a ratio of about 15 wt % to about 70 wt % based on thetotal content of the resin composition. In detail, the epoxy resin maybe contained at a ratio of about 15 wt % to about 60 wt % based on thetotal content of the resin composition.

The epoxy resin may include an alicyclic epoxy resin and a triazinederivative epoxy resin. The alicyclic epoxy resin may be contained at aratio of about 10 wt % to about 50 wt % based on the total content ofthe resin composition. In detail, the alicyclic epoxy resin may becontained at a ratio of about 15 wt % to about 35 wt % based on thetotal content of the resin composition.

If the epoxy resin composition according to the embodiment contains thealicyclic epoxy resin less than about 10 wt %, the optical property andmoisture-resistant property of the epoxy resin composition may bedeteriorated. In addition, if the epoxy resin composition according tothe embodiment contains the alicyclic epoxy resin more than about 60 wt%, the heat-resistant property of the epoxy resin composition may bedeteriorated.

In addition, the triazine derivative epoxy resin may be contained at aratio of about 5 wt % to about 50 wt % based on the total content of theresin composition. In detail, the triazine derivative epoxy resin may becontained at a ratio of about 15 wt % to about 25 wt % based on thetotal content of the resin composition.

The alicyclic epoxy resin may be alicyclic hydrocarbon including atleast one epoxy group. In detail, the alicyclic epoxy resin may includecyclohexane substituted with an epoxy group. In more detail, thealicyclic epoxy resin may include cyclohexane substituted with an epoxygroup and an ether group. Further, the alicyclic epoxy resin may includeat least two cyclohexane substituted with an epoxy group and linked witheach other by an ether group.

The alicyclic epoxy resin may be expressed as a following chemicalformula 1:

In the chemical formula 1, n may be 1 to 1000. R1 may be selected fromhydrogen, a halogen group, an amino group, a C₁-C₃₀ alkyl group, analkoxy group, a carboxyl group and a C₅-C₃₀ aryl group. R2 may beselected from hydrogen, a halogen group, an amino group, a C₁-C₃₀ alkylgroup, an alkoxy group, a carboxyl group and a C₅-C₃₀ aryl group.

R3 may be a functional group including an epoxy group. That is, R3 maybe an alkyl group substituted with an epoxy group. R3 may be an epoxygroup. In detail, R3 may be expressed as a following chemical formula 2:

In the chemical formula 2, m may be 0 to 3, 0 or 1 to 3.

In particular, at least one of positions of 2, 3, 4 and 5 of cyclohexanemay be substituted with R3 and the remaining may be substituted with R2.

The alicyclic epoxy resin may be prepared through the condensation. Indetail, the alicyclic epoxy resin may be synthesized by usingcyclohexanediol having a following chemical formula 3 as a monomer. Forinstance, the alicyclic epoxy resin may be prepared through thecondensation with cyclohexanediol expressed as a following chemicalformula 3:

In the chemical formula 3, R1 may be selected from hydrogen, a halogengroup, an amino group, a C₁-C₃₀ alkyl group, an alkoxy group, a carboxylgroup and a C₅-C₃₀ aryl group. In addition, R2 may be selected fromhydrogen, a halogen group, an amino group, a C₁-C₃₀ alkyl group, analkoxy group, a carboxyl group and a C₅-C₃₀ aryl group.

R3 may be a functional group including an epoxy group. That is, R3 maybe an alkyl group substituted with an epoxy group. R3 may be an epoxygroup. In detail, R3 may be expressed as the above chemical formula 2.

The triazine derivative epoxy resin may be a triazine derivativeincluding at least one epoxy group. In detail, the triazine derivativeepoxy resin may be a triazine derivative including three epoxy groups.

The triazine derivative epoxy resin may be an isocyanurate epoxy resin.That is, the triazine derivative epoxy resin may be expressed as afollowing chemical formula 4:

In the chemical formula 4, at least one of R4, R5 and R6 may be afunctional group including an epoxy group. In detail, at least one ofR4, R5 and R6 may be an alkyl group substituted with an epoxy group. Atleast one of R4, R5 and R6 may be an epoxy group. In more detail, atleast one of R4, R5 and R6 may be expressed as the chemical formula 2.In the chemical formula 2, m may be 1 to 3. In detail, m may be 1.

In addition, the remaining of the R4, R5 and R6 may be selected fromhydrogen, a halogen group, an amino group, a C₁-C₃₀ alkyl group, analkoxy group, a carboxyl group and a C₅-C₃₀ aryl group.

All of the R4, R5 and R6 may be functional groups including epoxygroups. In detail, the R4, R5 and R6 may be expressed as the abovechemical formula 2.

In more detail, the isocyanurate epoxy resin may includetriglycidylisocyanurate (TGIC).

In addition, the epoxy resin may further include other epoxy resins. Inother words, the epoxy resin may further include typical epoxy resinshaving at least two epoxy groups in a molecule besides the triazinederivative epoxy resin and the alicyclic epoxy resin.

For instance, the epoxy resin may further include one or at least two ofbisphenol A, 3,3′,5,5′-tetramethyl-4,4′-dihydroxydiphenylmethane,4,4′-dihydroxydiphenylsulfone, 4,4′-dihydroxydephenylsulfide,4,4′-dihydroxydiphenylketone, fluorenebisphenol, 4,4′-biphenol,3,3′,5,5′-tetramethyl-4,4′-dihydroxybiphenyl, 2,2′-biphenol, resorcin,catechol, t-butylcatechol, hydroquinone, t-butylhydroquinone,1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene,1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene,1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene,1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene,2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene,2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene,2,8-dihydroxynaphthalene, allide or polyallide of dihydroxynaphthalene,allylbisphenol A, allylbisphenol F, divalent phenols such asallylphenolnovolac, or phenol novolac, bisphenolAnovolac,o-cresolnovolac, m-cresolnovolac, p-cresolnovolac, xylenolnovolac,poly-p-hydroxystyrene, tris-(4-hydroxyphenyl)methane,1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, fluoroglycinol, pyrogallol,t-butylpyrogallol, allidepyrogallol, polyallidepyrogallol,1,2,4-benzenetriol, 2,3,4-trihydroxybenzophenone, phenolaralkyl resin,naphtholaralkyl resin, phenols of 3-valance or more such asdicyclopentadiene resin, and glycidylether derived from halogenatedbisphenols such as tetrabromobisphenol.

Various types of hardeners generally known as epoxy resin hardeners maybe used as the hardener for the epoxy resin composition according to theembodiment, preferably, a phenol hardener is used.

The hardener may be contained at a ratio of about 5 wt % to about 50 wt% based on the total content of the epoxy resin composition.

The phenol hardener is a single phenol compound and may include a phenolresin in addition to the phenol compound.

In detail, the phenol hardener may include bisphenol A, bisphenol F,4,4′-dihydroxydiphenylmethane, 4,4′-dihydroxydiphenylether,1,4-bis(4-hydroxyphenoxy)benzene, 1,3-bis(4-hydroxyphenoxy)benzene,4,4′-dihydroxyphenylsulfide, 4,4′-dihydroxyldiphenylketone,4,4′-dihydroxydiphenylsulfone, 4,4′-di hydroxydiphenyl,2,2′-dihydroxydiphenyl,10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide,phenolnovolac, bisphenolAnovolac, o-cresolnovolac, m-cresolnovolac,p-cresolnovolac, xylenolnovolac, poly-p-hydroxystyrene, hydroquinone,resorcin, catechol, t-butylcatechol, t-butylhydroquinone,fluoroglycinol, pyrogallol, t-butylpyrogallol, allylpyrogallol,polyallylpyrogallol, 1,2,4-benzenetriol, 2,3,4-trihydroxybenzophenone,1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene,1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene,1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene,1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene,2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene,2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene,2,8-dihydroxynaphthalene, allide or polyallide of thedihydroxynaphthalene, allylbisphenolA, allylbisphenolF,allylphenolnovolac, and allylpyrogallol.

The hardener may be prepared by mixing at least two types of hardeners.

Meanwhile, the hardener generally known in the art can be used insteadof the phenol hardener. For instance, the hardener may include an aminehardener, an acid anhydride hardener, a phenol hardener, a polymercaptanhardener, a polyaminoamide hardener, an isocyanate hardener or a blockedisocyanate hardener. The content of the hardener may be appropriatelyset by taking into consideration the type of the hardener and theproperty of the thermal conductive epoxy resin to be obtained.

In detail, the amine hardener may include aliphatic amines, polyetherpolyamines, alicyclic amines, aromatic amines, and the like. Thealiphatic amines may include ethylenediamine, 1,3-diaminopropane,1,4-diaminopropane, hexamethylenediamine,2,5-dimethylhexamethylenediamine, trimethylhexamethylenediamine,diethylenetriamine, iminobispropylamine, bis(hexamethylene)triamine,triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine,N-hydroxyethylethylenediamine, tetra(hydroxyethyl)ethylenediamine, andthe like. The polyether polyamines may include triethyleneglycolamine,tetraethyleneglycoldiamine, diethyleneglycolbis(propylamine),polyoxypropylenediamine, polyoxypropyleneamines, and the like. Thealicyclic amines may include isophoronediamine, methendiamine,N-aminoethylpiperazine, bis(4-amino-3-methyldicyclohexyl)methane,bis(aminomethyl)cyclohexane,3,9-bis(3-aminopropyl)2,4,8,10-tetra-oxaspiro(5,5)undecan,norbornenediamine and the like. The aromatic amines may includetetra-chloro-p-xylenediamine, m-xylenediamine, p-xylenediamine,m-phenylenediamine, o-phenylenediamine, p-phenylenediamine,2,4-diaminoanisole, 2,4-toluenediamine, 2,4-diaminodiphenylmethane,4,4′-diaminodiphenylmethane, 4,4′-diamino-1,2-diphenylethane,2,4-diaminodiphenylsulfone, 4,4′-diaminodiphenylsulfone, m-aminophenol,m-aminobenzylamine, benzyldimethylamine, 2-(dimethylamino-methyl)phenol,triethanolamine, methylbenzylamine, α-(m-aminophenyl)ethylamine,α-(p-amino-phenyl)ethylamine, diaminodiethyldimethyldiphenylmethane,α,α′-bis(4-aminophenyl)-p-diisopropylbenzene and the like.

The anhydride hardener may include dodecenylsuccinicanhydride,polyadipicacidanhydride, polyazelaicacidanhydride,polysebacicacidanhydride, poly(ethyloctadecanedoicacid)anhydride,poly(phenylhexadecanedoicacid)anhydride,methyltetrahydrophthalicanhydride, methylhexahydrophthalicanhydride,hexahydrophthalicanhydride, anhydrousmethylhimicacid,tetrahydrophthalicanhydride, trialkyltetrahydrophthalicanhydride,methylcyclohexenedicarboxylicacidanhydride,methylcyclohexenetetracarboxylicacidanhydride, phthalicanhydride,trimelliticanhydride, pyromelliticacidanhydride,benzophenonetetracarboxylicacidanhydride, ethyleneglycolbistrimellitate,anhydrousheticacid, anhydrousnadicacid, anhydrousmethylnadicacid,5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexane-1,2-dicarboxylicacidanhydride,3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalenesuccinicanhydride,1-methyl-dicarboxy-1,2,3,4-tetrahydro-1-naphthalenesuccinicanhydride andthe like.

The catalyst may promote the curing reaction of the epoxy resincomposition according to the embodiment. The catalyst may be containedin the epoxy resin composition according to the embodiment at a ratio ofabout 0.1 wt % to about 2 wt %. The catalyst may include a metal, suchas Pb, Pt or Ti. In addition, triphenylphospin (TPP) may be used as thecatalyst. Further, the catalyst may include amidazole type tertiaryamine, quaternary ammonium salt, amidines and its derivatives, phosphineor phosphonium. Various materials having superior curability with nocolor may be used as the catalyst.

The additive may be contained in the epoxy resin composition accordingto the embodiment at a ratio of about 0.1 wt % to about 10 wt %. Theadditive may include a dispersing agent, a leveling agent, and anantioxidant. The dispersing agent may include a silicon type dispersingagent.

In addition, the leveling agent may include a sulfonic compound or anester compound. Further, the antioxidant may includephenyl-β-naphthylamine, aromatic amines or hydroquinone.

Furthermore, the dispersing agent, leveling agent and antioxidantgenerally known in the art can be used as the additive for the epoxyresin according to the embodiment.

Hereinafter, a light emitting diode package will be described in detailwith reference to FIG. 1.

In the description of the embodiments, it will be understood that wheneach substrate, layer, film or electrode is referred to as being “on” or“under” another substrate, layer, film or electrode, it can be“directly” or “indirectly” on or under another element or the otherconstituent elements may also be present. Such a position of theelements will be determined based on the drawings. The size of theelements shown in the drawings may be exaggerated for the purpose ofexplanation and may not utterly reflect the actual size.

FIG. 1 is a sectional view showing the light emitting diode packageaccording to the embodiment.

Referring to FIG. 1, the light emitting diode package according to theembodiment includes a body part 100, lead electrodes 210 and 220, alight emitting chip 300 and a filling part 400.

The body part 100 includes a cavity having an open top surface. Thecavity C may be formed by punching, cutting or etching the body part100. In addition, the cavity C may be simultaneously formed with thebody part 100 by using a metal mold having the internal structureidentical to the cavity C.

The cavity C may have a cup shape or a concave container shape and asurface of the cavity C may have a circular shape, a polygonal shape ora random shape, but the embodiment is not limited thereto.

A sidewall of the cavity C may be vertical or inclined with respect to abottom surface of the cavity C by taking a light distribution angle ofthe light emitting diode package according to the embodiment intoconsideration.

The lead electrodes 210 and 220 may be integrally formed with the bodymember 100. In detail, two lead electrodes 210 and 220 may be providedin one body part 100. The lead electrodes 210 and 220 may constitute alead frame, but the embodiment is not limited thereto.

The lead electrodes 210 and 220 are disposed in the body part 100 suchthat the lead electrodes 210 and 220 can be electrically isolated fromthe bottom surface of the cavity C. Outer portions of the leadelectrodes 210 and 220 may be exposed out of the body part 100.

End portions of the lead electrodes 210 and 220 may be disposed on oneside of the cavity C or may be disposed opposite to the cavity C.

The lead electrodes 210 and 220 may be prepared in the form of a leadframe and the lead frame may be formed when the body part 100 isinjection-molded. For instance, the lead electrodes 210 and 220 mayinclude a first lead electrode 210 and a second lead electrode 220.

The first and second electrodes 210 and 220 are spaced apart from eachother. The first and second lead electrodes 210 and 220 are electricallyconnected to the light emitting chip 300.

The light emitting chip 300 is disposed in the cavity C. The lightemitting chip 300 is a light emitting unit that generates light. Indetail, the light emitting chip 300 may be a light emitting diode chipthat generates the light. For instance, the light emitting chip 300 mayinclude a colored light emitting diode chip or a UV light emitting diodechip. One light emitting chip 300 may be disposed in one cavity C.

The filling part 400 is disposed in the cavity C. The filling part 400is filled in the cavity C. The filling part 400 covers the lightemitting chip 300. The filling part 400 may seal the light emitting chip300 against external environment. In addition, the filling part 400 mayhave a convex shape to serve as a lens. In addition, phosphors may bedistributed in the filling part 400.

The body part 100 and/or the filling part 400 may be formed by using theepoxy resin composition according to the embodiment. That is, the bodypart 100 and/or the filling part 400 can be formed by curing the epoxyresin composition according to the embodiment through a thermal curingprocess.

Accordingly, the body part 100 and/or the filling part 400 may includepolymer including isocyanurate and alicyclic hydrocarbon linked witheach other through an ether group. In detail, the body part 100 and/orthe filling part 400 may include polymer having a net structure which isprepared by linking isocyanurate and cyclohexane with each other throughan ether group.

Therefore, the body part 100 and/or the filling part 400 may have theimproved moisture-resistant property, heat-resistant property andtransmittance.

As described above, the epoxy resin composition according to theembodiment includes a triazine derivative epoxy resin and an alicyclicepoxy resin. Thus, the epoxy resin composition according to theembodiment may have the improved moisture-resistant property,heat-resistant property and transmittance.

In other words, the epoxy resin composition according to the embodimentcan be formed by appropriately combining a triazine derivative epoxyresin, such as isocyanurate epoxy resin, and an alicyclic epoxy resin sothat the epoxy resin composition may have the improved reliability andoptical property.

In addition, the epoxy resin composition according to the embodiment canbe used for the body part 100 and/or the filling part 400. Thus, thelight emitting diode package according to the embodiment can inhibit thebody part 100 and/or the filling part 400 from being thermally deformedand inhibit the moisture from penetrating into the light emitting chip300. Therefore, the light emitting diode package according to theembodiment may have the improved reliability and optical property.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effects such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

Experimental Example and Comparative Example

Triglycidylisocyanurate (hereinafter referred to as epoxy resin 1), analicyclic epoxy resin (hereinafter referred to as epoxy resin 2)expressed as the chemical formula 1 wherein n is 1 to 5, R1 and R2 arehydrogen and R3 is an epoxy group, a hardener (MeHHPA(Methylhexahydrophthalic anhydride) or HHPA (Hexahydrophthalicanhydride)), a catalyst (Triphenylphosphine) and an additive(phenyl-β-naphthylamine) were mixed as shown in Table 1 to prepare anepoxy resin composition.

Then, the thermal curing process was performed for about 2 hours at thetemperature of about 100° C. to prepare a specimen having a thickness ofabout 2 mm. After that, the moisture absorption (humidity permeated at100% humidity was measured for 24 hours at the temperature of 121° C.),the heat-resistant property (reduction of transmittance was measuredwith respect to a light having a wavelength band of 450 nm after leavingthe specimen for 1000 hours at the temperature of 120° C.), the initialtransmittance (measured with respect to a light having a wavelength bandof 450 nm) and the transmittance retention (reduction of transmittancein comparison with the initial transmittance was measured with respectto a light having a wavelength band of 450 nm after leaving the specimenfor 24 hours at the temperature of 175° C.) were measured, respectively.

TABLE 1 Experi- Experi- Experi- Experi- Experi- Experi- Compar- Compar-mental mental mental mental mental mental ative ative Ex. 1 Ex. 2 Ex. 3Ex. 4 Ex. 5 Ex. 6 Ex. 1 Ex. 2 Epoxy resin 1 33 23 13 33 23 13 46 0 (wt%) Epoxy resin 2 13 23 33 13 23 33 0 46 (wt %) MeHHPA 50 50 50 50 50 (wt%) HHPA (wt %) 50 50 50 Catalyst 3 3 3 3 3 3 3 3 (wt %) Additive 1 1 1 11 1 1 1 (wt %) Moisture 3.13 3.10 3.01 3.25 3.19 3.09 5.49 2.91absorption (%) Heat 90 87 82 89 85 80 91 78 resistance (%) Initial 90 9091 89 90 91 86 92 transmittance (%) Transmittance 90 90 91 87 90 91 8393 retention (%)

Result

As can be understood from Table 1, experimental examples 1 to 6represent the improved moisture-resistant property, heat-resistantproperty and optical property as compared with those of comparativeexamples 1 and 2.

What is claimed is:
 1. An epoxy resin composition comprising: a triazinederivative epoxy resin; and an alicyclic epoxy resin.
 2. The epoxy resincomposition of claim 1, wherein the alicyclic epoxy resin is expressedas a following chemical formula 1:

(wherein, n is 1 to 1000, R1 is selected from hydrogen, a halogen group,an amino group, a C₁-C₃₀ alkyl group, an alkoxy group, a carboxyl groupand a C₅-C₃₀ aryl group, R2 is selected from hydrogen, a halogen group,an amino group, a C₁-C₃₀ alkyl group, an alkoxy group, a carboxyl groupand a C₅-C₃₀ aryl group, and R3 is expressed as a following chemicalformula 2)

(wherein, m is 0 to 3).
 3. The epoxy resin composition of claim 2,wherein the R1 and R2 comprise hydrogen.
 4. The epoxy resin compositionof claim 3, wherein the n is 1 to
 10. 5. The epoxy resin composition ofclaim 3, wherein the triazine derivative epoxy resin comprises anisocyanurate epoxy resin.
 6. The epoxy resin composition of claim 5,wherein the isocyanurate epoxy resin is expressed as a followingchemical formula 4:

(wherein, at least one of R4, R5 and R6 is expressed as the chemicalformula 2 (m is 1 to 3) and a remaining of the R4, R5 and R6 is selectedfrom hydrogen, a halogen group, an amino group, a C₁-C₃₀ alkyl group, analkoxy group, a carboxyl group and a C₅-C₃₀ aryl group).
 7. The epoxyresin composition of claim 6, wherein the isocyanurate epoxy resincomprises triglycidylisocyanurate.
 8. The epoxy resin composition ofclaim 6, wherein the alicyclic epoxy resin is contained at a ratio ofabout 10 wt % to about 50 wt %.
 9. The epoxy resin composition of claim6, wherein the triazine derivative epoxy resin is contained at a ratioof about 10 wt % to about 50 wt %.
 10. The epoxy resin composition ofclaim 6, further comprising a hardener, a catalyst and an additive,wherein the additive comprises a dispersing agent, a leveling agent, andan antioxidant.
 11. The epoxy resin composition of claim 6, wherein thehardener is contained at a ratio of about 5 wt % to about 50 wt % basedon a total content of the epoxy resin composition, the catalyst iscontained at a ratio of about 0.1 wt % to about 2 wt % based on thetotal content of the epoxy resin composition, and the additive iscontained at a ratio of about 0.1 wt % to about 10 wt % based on thetotal content of the epoxy resin composition.
 12. A light emittingapparatus comprising: a light emitting chip; a body part to receive thelight emitting chip; and a filling part to cover the light emittingchip, wherein the body part or the filling part is formed by an epoxyresin composition comprising a triazine derivative epoxy resin and analicyclic epoxy resin.
 13. The light emitting apparatus of claim 12,wherein the alicyclic epoxy resin is expressed as a following chemicalformula 1:

(wherein, n is 1 to 1000, R1 is selected from hydrogen, a halogen group,an amino group, a C₁-C₃₀ alkyl group, an alkoxy group, a carboxyl groupand a C₅-C₃₀ aryl group, R2 is selected from hydrogen, a halogen group,an amino group, a C₁-C₃₀ alkyl group, an alkoxy group, a carboxyl groupand a C₅-C₃₀ aryl group, and R3 is expressed as a following chemicalformula 2)

(wherein, m is 0 to 3).
 14. The light emitting apparatus of claim 13,wherein the triazine derivative epoxy resin comprises an isocyanurateepoxy resin expressed as a following chemical formula 4:

(wherein, at least one of R4, R5 and R6 is expressed as the chemicalformula 2 (m is 1 to 3) and a remaining of the R4, R5 and R6 is selectedfrom hydrogen, a halogen group, an amino group, a C₁-C₃₀ alkyl group, analkoxy group, a carboxyl group and a C₅-C₃₀ aryl group).
 15. The lightemitting apparatus of claim 14, wherein a cavity is formed in the bodypart, the light emitting chip is disposed in the cavity, the fillingpart is disposed in the cavity and the body part is formed by the epoxyresin composition
 16. The light emitting apparatus of claim 15, whereinthe n is 1 to 10, the m is 1, and the R1 and R2 comprise hydrogen. 17.The light emitting apparatus of claim 14, wherein the isocyanurate epoxyresin comprises triglycidylisocyanurate.
 18. The light emittingapparatus of claim 14, wherein the alicyclic epoxy resin is contained ata ratio of about 10 wt % to about 50 wt % and the triazine derivativeepoxy resin is contained at a ratio of about 10 wt % to about 50 wt %.19. The light emitting apparatus of claim 12, wherein the epoxy resincomposition further comprises a hardener, a catalyst and an additive,and the additive comprises a dispersing agent, a leveling agent, and anantioxidant.
 20. The light emitting apparatus of claim 19, wherein thehardener is contained at a ratio of about 5 wt % to about 50 wt % basedon a total content of the epoxy resin composition, the catalyst iscontained at a ratio of about 0.1 wt % to about 2 wt % based on thetotal content of the epoxy resin composition, and the additive iscontained at a ratio of about 0.1 wt % to about 10 wt % based on thetotal content of the epoxy resin composition.